Surface
mount technology is one of the most preferred methods of placing or mounting
components on printed circuit boards. It has greatly replaced through-hole
technology and gave electronic designers and circuit board assemblers an
alternative and more reliable means to fit components into the circuit board.
In some cases, surface mount technology may be used in conjunction with
through-hole technology, especially when certain components are unsuitable for
surface mounting, as in the case of heat-sinked power semiconductors and large
transformers.
There
are various reasons to prefer
surface mount to conventional PCB assembly methods. One of its advantages
is its versatility and reliability when it comes to linking different
individual parts in a single electronics system. This results in higher
productivity, minimal downtime, and improved product quality. With the surface
mount technology, you can manufacture smaller and more components for improved
performance, especially in smaller hand-held devices.
Components
that are made using surface mount technology are smaller and enable higher
component density on printed circuit boards. With surface mount, automated
assembly can be faster and seamless because it allows more than a single
component to be placed on the board per hour. Small errors can be corrected
automatically to reduce downtime. SMTs are better in mechanical performance,
too, especially under situations where shaking or vibrations are common.
Experienced
and reputable electronic design and circuit board assembly companies use
surface mount technology to assemble printed circuit boards. They use high-end
machinery—such as high-speed surface mount lines—to manufacture a large amount
of various electronic assemblies. At the same time, they utilize the services
of IPC certified manufacturing technicians to manually assemble other
additional parts that machines may not be able to assemble or place.
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